In-depth diagnosis & BGA / SMD repair
Intermediate level — restoring faulty equipment
Level N2 is for equipment with a functional fault or failed electronic components. It involves advanced electronic diagnosis and component-level repair to restore the equipment's original performance.
Objective
Repair, not just replace
N2 goes beyond a simple functional check: the aim is to pinpoint the cause of a fault at circuit level, then work directly on the components concerned — replacing surface-mount devices (SMD) or repairing BGA chips — rather than replacing the entire board or unit. This approach recovers value from equipment that would otherwise be scrapped.
Process steps
A 5-step protocol
In-depth electronic diagnosis
Testing on specialised benches, electrical measurements, thermal analysis and signal checks to pinpoint the source of the fault.
Identification of failed components
Isolating the component(s) at fault (capacitors, integrated circuits, connectors, BGA chips) and assessing whether repair is feasible.
SMD component replacement
Desoldering and refitting surface-mount components using precision micro-soldering stations, under the microscope.
BGA repair
Reballing and reattaching BGA (Ball Grid Array) chips on a rework station, with controlled thermal profiles to preserve the integrity of the board.
Validation testing & enhanced quality control
Full post-repair functional check, load and stability testing, then detailed documentation of the work carried out.
Typical use cases
Damaged circuit boards
Faults caused by an identifiable, repairable failed component.
Intermittent faults
Occasional malfunctions requiring precise electronic diagnosis.
Telecom & industrial equipment
Equipment that would be costly or hard to replace entirely.
Faulty equipment that needs diagnosing?
Our teams assess whether repair is feasible before any commitment — tailored quote.
Request a quote